I have had some fragile boards where I cut each pin, then took the new IC, and formed the leads to be close to the plastic case, then cut off the end, and soldered to the existing leads. Had to be done, as the original board was vapour phase reflowed, and they used double sided DIP loading, with each one staggered 0.1in from each other, to fit the number of packages they needed into the limited volume. You had to be really sure an IC was toast before replacing it. Another in the test bench, to avoid having to play in the wire wrapped and soldered underside (wire wrap and solder, just in case there was vibration) I simply cut the sides off the socket, and soldered the new turned pin socket to the stubs thus exposed. Then put the fusible link PROM into the socket, thankful that the original manufacturer had not soldered this particular IC into the socket, like the rest of the board had.