thermal paste replacing that thermal pad, NO NO NO
it isn't so much difference in thermal conductivity between the pad and some conductive/risky paste
i have tested pads with almost same result as good paste, the paste needs some degree of precision
if you want cooling and you got the space, put a real heat dissipator like the ones for memories/raspberry pi's, they come cheap enough. then your heat dissipation is resolved
imho, reflow process is first about flux quality and second about heating profile
serious machines do bottom heating (at home i use also a heating plate with 120C for example) and top heating must respect temp/time for the flux to do his job, then you rise the temp and do the second reflow ramp/peak. i'd guess you can look at standard profiles and adapt, just don't overheat. i bet you got alloy without Pb and it's tricky