I got thinking about what product to use on lifted traces or solder pads that one often finds on previously repaired boards. Not missing traces, but ones still there, but up in the air. One of the problems is the need to solder replacement components to the repaired copper pads after doing the trace repair. That takes heat which kills a bunch of cements or glues, but Loctite Red after curing is rated to 500 deg's F (260 deg's C) and I've used it in the past to glue together not heavily stressed broken metal parts where epoxy has failed. So I was wondering if you use a low temp solder if it might be possible to not lift the repaired traces a 2nd time and therefore end up with a decent result.
Has anyone tried this or some other high temp product? I'm going to try this on the next board in need of TLC that I find. Thoughts?