SMD soldering two questions - suggested paste and rework approach w/o stencil

[wb0gaz]

I'm pretty new at SMD soldering, working mostly with QFP (0.635mm pitch) packages.

Two questions:

1. Looking for recommendation for a 63/37 paste that's somewhat sticky/tacky flux; the paste I'm using (no-name from china) is close to liquid which makes it hard to tidy up paste after application but before hot air soldering (I try to guide it to where it should go and have it stay in place to make application more even; even with a stencil this solder oozes all over the place) and also hard to get the part itself into position without it seeming to slide around (as if the flux is acting too much like a mechanical lubricant.)

2. How is rework handled when the part needs to be replaced and the original stencil (I've been using proto-advantage type single-part stencils to apply solder for initial assembly when the part is the first thing going on to a blank board) can't be used due to obstructions from other parts? For rework, I've been hand applying solder paste (tiny needle) and that brings me back to the first question - controlling amount/placement with adequate precision (I do this under a kid's stereo microscope that's worked well as a tool) to reduce risk of bridges (which I clean up after the fact with solder wick) and necessity of touch-up by soldering iron.

Thanks for advice/pointers!

Dave

[tautech]

Right or wrong don't matter only what works best for you.
Many times I have pointed to the video in this post as a quite different approach:
https://www.eevblog.com/forum/beginners/so-surface-mount-it-is/msg1442590/#msg1442590

The whole thread is worthy of a study.