You want to use a high-Tg epoxy, so that it doesn't turn to goo (or worse) at soldering temperature. Hardware store 1-minute-cure stuff seems to be rather poor at this. Probably filler helps, but also the slower cure types seem to do better (30 minute, "2 ton", etc.).
Also just bog standard JB Weld, it's rated for quite high temperatures and is already filled. Downside, the filler is metal; it's not conductive over any sample I've seen, but it's maybe not a good look on electronics. But any of the comparable ceramic-filled types will do, for sure.
And yeah, UV cure epoxy can do quite well. Soldermask itself is the same stuff. You'll need a UV LED pen or other light, or enough sunlight exposure, to cure it. Not sure how well it'll cure underneath a black component, maybe it just takes longer? Can test it a few times -- if it snaps off from reasonable forces, or like bubbles up under soldering heat, just clean it off and try again.
As for soldering, I don't have a problem with that, tacking the part to a ground pad that is. If the pad pulls off that easily, it was probably too high electrical impedance as well, to do the job! Preferably it will be tied directly to ground plane, which the USB traces will also be routed over (for immunity as well as controlled impedance).
Tim