Ok in same boat as OP perdrix same IC ........same PCB.
I removed the SO20 package ok...grind it away to expose metal substrate and GND base tab. Then de-solder leftovers came away easily. Still, a hair raising task!
Ok now the hard part, soldering a new one back. It's a 4 Layer PCB inbetween are 3.3V and 5V planes. The Top has a decent top and bottom GND pad under the package with plenty of vias thru.
I'm thinking I can wet the SO20 package GND plate then use the end tabs with twin irons to reflow. Testing showed this possible but that wasn't with the PCB GND planes. Maybe I should be trying a lower melt solder paste? Should I? Only ever use chipquik for removal and its too low temp for this application. Maybe other pastes?
I also tried a big 120W iron "Bertha" from under and can get the top GND plane to solder melt in around 20 seconds. This is pumping heat thru all layers this I noted. Maybe I can pre-heat with this.
I've read ST TN1258 tech notes info on SO20 packages and reflow but they don't mention how! Do I use the end tabs, see picture? I guess I preheat the PCB with Bertha then use the end tabs.....but I'm so unsure its a package that has me past my comfort level.
I do have a hot air station....FWIW.
Any ideas on fitting new IC down welcome (low temp paste?, pre-heat?, use Bertha?, use the end tabs and twin irons?)...like perdrix expensive IR reflow is out of the question...help me I'm poor!
Edit: to wrap up I tacked the legs, removed that capacitor near the top of the IC to allow twin irons on the IC Tabs. I solder wet the underside of the IC plate, used large wattage iron under on GND plane to heat thru to the top and went for it to reflow the plate wetting to the GND plane.
Ok it worked but there was too much heat IMHO. Ok it’s all now working fine but I won’t do it that way again. Just too much heat. Might get some 138C low melt paste