The "Red stuff" is solder mask I already mentioned. I've already played with it, no good.
It needs UV to cure. X-rays might get through the pad, but UV won't.
Below the pad, it'll remain as a soup, the pad will only be held by the borders, will suddenly come off, and you'll see the nice masking template.
Rub with alcohol and get a nice empty square!
It's brittle when holding stuff, but it's almost impossible to remove without causing at least some scratches to the board.
Yep, high temperature epoxy was my next idea. But epoxy is bulky, hard to apply in very low quantities.
The worse part is the 5-minute curing time. If fixing several pads or you run into any issue, you have a very tight time window to work with it.
If by any means it cures too soon... good luck fixing that!
I've found EP17HT-LO, which looked great: one-part epoxy (No messy mixing), heat curing and widthstands 600ºF/315ºC.
...but curing time is 350ºF /177ºC for 1-2 hours. Too much, specially for populated boards.
So yes, I guess epoxi is the way but have to find a good one. Not too fast, not too slow.
I wonder what's the epoxy used in the IC packages. That stuff hanbdles anything.
I've tried to burn them at 400ºC for 10 minutes, not only it did nothing, but the mcu still worked!
Long story short:
I have a board in which I wanted to test several ICs.
For those reworks I would normally use leaded solder, but... I ran out of solder.
Dumb me, I took an old lead-free alloy from the 2010s, melted terribly bad and was for emergency use only.
So yeah, stupid me for not wanting to wait, the removal was a nightmare and the board quality 4/10, so the pads started to fly away like dry leaves in the wind!
For 1-2 pads, meh, a simple wire soldered to the trace, but it's 30+ pads
