Almost any station will do for "occasionall" work and the chips you are saying.
About custom nozzles i'm a bit lazy and i always use the same round 8mm nozzle, you can do almost everything with it.
I have the 861DW, great machine
I find it easy to remove plastic parts like switch, FPC, etc without melt them, 280-300ºc is good for me. Also it can rework big BGA chips, i have done some CPU replacements on TV mains, still a preheater for big chips are recommended.
BGA with critical nearby chips with underfill are also kinda of easy, just protect what you need, blast it a max. airflow (120) at 320-330ºc. It will desolder lead free BGA without mess with other area. This work with iPhone which have big thermals