I have problems also if there is too much flux, or also when in a spot there is a bit more flux, that when become liquid due to heat, move some balls due to superficial tension
The air of my station in low setting not move the balls enough to create problems.
In any case i preheat the chip and do only the final weld with hot air. Maybe doing all the work with big bga and heating all the package with only low aiflow may cause some problem