Also for reference, tinning is used in high-reliability processes specifically to wash the surface of gold, to prevent formation of Au-Sn intermetallic layers which are especially weak. So you'll see certain NASA documents for example, instructing connector pins to be tinned, cleaned, tinned again, etc., then finally assembled with the wire or board. (You'll also see ones tinning pure-tin surfaces with leaded solder, to help prevent whisker formation. Over the time scales in which satellites and avionics must operate, this is key; however for commercial, industrial and automotive purposes, it seems tighter process control is sufficient to offer 10yr+ product lifetimes in lead-free.)
Tim