Opinion for solder/desoldering hot air pencil PACE TJ-85 Thermojet (IntelliHeat)

[leftek]

Hello everybody,

I am consider to buy the hot air pencil PACE TJ-85 Thermojet (IntelliHeat) for SMD components. I will use it with my ST115 base and my needs is from small up to (rarely) 14pin IC SMD.

Have anybody try this pencil in order to share his opinion? It's worth this or suggest another tool?

[thm_w]

Do you have an 858D? I would just use that instead, unless you are doing specific precise rework.

https://www.eevblog.com/forum/repair/curious-case-of-pace-tj-70/

[Shock]

I chose the TJ70 over the TJ85, the difference are the TJ70 has an airflow button and I felt it had better selection of tips. The TJ85 is a slimmer tool but requires the foot pedal to actuate the air. The TJ70 can still utilize the foot pedal but it's optional. It also looks easier to make custom tips for.

As thm_w mentioned they are a precision tool, so not for removing large bga or quad packages. In some situations you should use underside preheating at the same time, but this applies to hot air rework in general. If you want more general preheating you can also use them with the tips removed.

Here is my TJ70 with the full set of tips, these are about 1-2mm where as the most of the larger hot air stations start at about 3mm. You can use them for all sorts of things. Flow soldering, shrink, curing, pad repair and misc track work.

[leftek]

As thm_w mentioned they are a precision tool, so not for removing large bga or quad packages.

For example, can you handle (removing) SOIC 14 packages easy?

these are about 1-2mm where as the most of the larger hot air stations start at about 3mm

This is advantage or disadvantage? This seem as reduced power against others or not?

[Shock]

The Pace Thermojets can desolder small packages for removal under the right conditions. The smaller nozzles advantage is localized heating for fine work but aren't suitable for covering larger areas desoldering. When soldering however, larger packages (dual and quad) don't need simultaneous reflow on all pins at once.

The Pace TJ70 flat tips are about 7x2mm and 6x2mm. The Pace TJ85 flat tip about 6mm x 2mm so those would be more suitable for desoldering SOIC14 as you get close to row coverage. The TJ70 dual nozzle (1121-0330-P1) has a 4.3mm offset so good spacing for soldering a SOIC14.

Ideal technique is to soak the pcb gently with hot air or underside preheating to reduce the delta temp (target temp difference), then bring it up to simultaneous melt with the tool. Using flux or a low temp alloy like chipquik will also help with desoldering.

[leftek]

Thank you very much for your information. I will get one of these. I hope to be suitable for the most of my cases.

[leftek]

What is your opinion about the hot air tool against this  https://paceworldwide.com/mt-100-minitweez-surface-mount-rework-tweezer-handpiece-intelliheat MT-100 Mini Tweezer tool ?

[thm_w]

We don't know what your use cases are.
If you want a general use tool, get an 858D clone.
If you are swapping 0603's all day long, get the mini tweezers.

[Shock]

It is hard to gauge usage, if you are in business and doing frequent desoldering the Pace MT100 tweezers are going to cut down time in many situations compared to hot air. Specifically for my usage in rework doing removals I use the SX100, MT100, TJ70, TT65 in that order. Pace does tweezer blades from 8mm up to 28mm, smaller than that you can typically use the leg fill/bridge method for removal.

I agree with thm_w, a 858D or a Quick 861DW hot air would probably be the most flexible hot air. Just keep in mind the 858D is a "turn it off at the wall" type product (not the safest).

The Thermojets compared to full BGA capable rework stations are at opposite ends of the hot air spectrum. People are using BGA capable stations designed to do large package soldering/removal along with preheating to just blast boards from the top without preheating. It's the quick and dirty method but it's a double edged sword, like ESD hard to see what immediate damage is caused.

You can still remove TQFN and small SOIC etc with the Pace TJ70 you just have to be realistic about the package being workable with small tip sizes. Chipquik and preheating though roughly double the efficiency in any case.

[leftek]

I have bought the hot air pencil PACE TJ-85 Thermojet (IntelliHeat) and i have started to desolder very small components form one old and damaged PC motherboard, but the pencil not melt the solder. It's normal this, because of hardness of this solder or i do anything false?

[Shock]

Don't have that model but probably need to turn it up a bit to be effective. Read the manual if it has any pointers, or email/call Pace.

Motherboards are really good at dispersing heat. Practice on old scrap boards first. If you have sensitive components shield or avoid heating them directly.

Use some flux, it helps solder flow. Gently preheat the area, that lowers the time you need to apply more focused heat to the target component. When the vicinity is well preheated, close in and go for reflow.

Having underside preheating can also make this less painful.

[leftek]

Read the manual if it has any pointers, or email/call Pace.

I have contacted with PACE. Their support is FANTASTIC.

Τhe false was mine. The tool work fine now.

[Shock]

I have contacted with PACE. Their support is FANTASTIC.
Τhe false was mine. The tool work fine now.

Oh I just remembered, disconnect the other tools air hose. I just helped someone with that a few months back. Anyway, good to hear you got it running.