It is hard to gauge usage, if you are in business and doing frequent desoldering the Pace MT100 tweezers are going to cut down time in many situations compared to hot air. Specifically for my usage in rework doing removals I use the SX100, MT100, TJ70, TT65 in that order. Pace does tweezer blades from 8mm up to 28mm, smaller than that you can typically use the leg fill/bridge method for removal.
I agree with thm_w, a 858D or a Quick 861DW hot air would probably be the most flexible hot air. Just keep in mind the 858D is a "turn it off at the wall" type product (not the safest).
The Thermojets compared to full BGA capable rework stations are at opposite ends of the hot air spectrum. People are using BGA capable stations designed to do large package soldering/removal along with preheating to just blast boards from the top without preheating. It's the quick and dirty method but it's a double edged sword, like ESD hard to see what immediate damage is caused.
You can still remove TQFN and small SOIC etc with the Pace TJ70 you just have to be realistic about the package being workable with small tip sizes. Chipquik and preheating though roughly double the efficiency in any case.