Hi,
I've posted before on this forum concerning a class-A R.F. PA that I've been building for a multi-carrier FM broadcast project. The current status of the design is that I'm using a NXP MRF300AN for my design, as it has a lower case-to-junction thermal resistance than my previous choice of MRF101AN (0.55 C/W as opposed to 1.1C/W).
Now, the design is performing reasonably well at this point, but I'm exploring options for pushing the power envelope.
Because this is class-A, thermal management is one of the prime concerns. I was exploring some NXP transistors and found this device.
MRFE6VP5150N - 150W CW, 1.8-600MHz.
https://www.nxp.com/products/radio-frequency/rf-industrial-scientific-and-medical/1-600-mhz-broadcast-and-ism/1-8-600-mhz-150-w-cw-50-v-wideband-rf-power-ldmos-transistors:MRFE6VP5150N?tab=Design_Support_TabWhile it's max rated power of 150W is lower than the MRF300AN's 300W it has much better thermal specs. Case to junction thermal resistance is 0.21 C/W (as opposed to 0.55 C/W) and max operating junction temperature is 225C as opposed to 175C.
However, since there are two MOSFETS on one die, this chip was designed with class-AB operation in mind, it seems.
I was wondering what if I just parallel up the two transistors and run them both in the linear region. Thoughts? Has anyone have experience with using these transistors in the linear region?
Thank you!