In case you want to try a more suitable material I recommend Eurocircuits. They have a pooling service for RF laminates. The Isola I-Tera in this configuration is a lot more affordable then fully custom RF stackups. It's still going to be more expensive than JLPCB.
FR4 might work to an extent just make sure that when you simulate, run variations over a wide range of Er values. E.g. between 4 to 5 maybe and check that you hit your target metrics regardless. Another issue with FR4 the higher dissipation factor, put that in the simulator too as it will increase your insertion loss significantly.
Another thing you can try with FR4 is to use a coplanar waveguide instead of the microstrip and a thicker board. This way the field strength and overall contribution will be stronger above the copper in air and lesser in the sketchy FR4 dielectric. The ground gap size gives you an extra parameter to tune your line impedance other than the dielectric thickness and the line width.
The via, I would EM simulate that. The planar simulator should be good for that in AWR or the full 3D if you want to go fancy. Alternatively you can experiment with the VIAMC element to simulate coupling between your signal via and surrounding gnd vias but it's really hard to verify if you set it up good.
In general if it's just for random experimentation I recommend the 6GHz circuit. It's a lot more forgiving and gives you a lot more opportunity to learn and understand what exactly is happening. It's definitely not without its challenges but compared to 24GHz it makes a big difference.
HTH.
Good luck!