Ok, all clear. So the jtag pins (if present) can be spread as single testpoints, and there is no simple way to know every point what do.
I was in the hope to find a "professional" way to know if a board have a failed solder (mainly for bga packages) instead of reaballing every single element (for example, if there is a communication problem between cpu and ram, both bga, how do you know in what of the 2 packages there is a problem).
A bad supply, a shorted or out of spec capacitor, a burnt ic can be spot/measured in some ways, but a failed solder point is not easy. Also if there is a test point for every pin, not knowing what signal pattern have that pin is useless.
Eventually the manifacteur know all for testing the boards after initial assembly, but this informations aren't disclosed. So, if i've well understood, no way to reverse engineer this connections without dismantling the whole board and follow the traces.