EEVblog Electronics Community Forum
Products => Test Equipment => Topic started by: SolarSunrise on December 10, 2013, 07:13:30 pm
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Hi there, I'm sorry for this potentially newbish but confusing question... Here we go:
I'm planning to reflow my PCB containing IC's which are: ADS1256, LMP7702, and OPA350.
In the datasheets, they only specify the lead temperature for soldering:
- ADS1256: 300C for 10s
- LMP7702: 260C for 10s
- OPA350: 300C for 10s
So for reflow, do I just follow the temperature curve specified for my solder paste or should I make some adjustments? In case I missed anything here's the manufacture's links for the parts:
http://www.ti.com/product/ads1256 (http://www.ti.com/product/ads1256)
http://www.ti.com/product/lmp7702 (http://www.ti.com/product/lmp7702)
http://www.ti.com/product/opa350 (http://www.ti.com/product/opa350)
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I just realized that this thread was under "Test Equipment" section... I'm sorry for the sort-of off topic thread... I'll try to fix it, if I can't, I'll look up to the moderators!
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If you look at the links you provide there is this table that states max. reflow temperature. See below for the ads1256 it is 260 degrees C.
If you google on Texas Instruments reflow profile you see a standard reflow profile.
I would still follow the temperature curve for the solderpaste unless it really deviates from the standard profile.