Products > Test Equipment
Replacement for Fluke 700013 IC (quad SPST analog switch)
<< < (13/16) > >>
magic:

--- Quote from: Noopy on July 07, 2021, 03:53:41 am ---The datasheet describes a ADG444A which is fabricated with an buried oxide layer to isolate the integrated transistors. The isolation prevents latch-up but probably also reduces leakage and crosstalk.

The die doesn´t look like to have this isolation layer.
In the OPA627 (https://www.richis-lab.de/Opamp22.htm) we have seen that it is possible to see an isolation layer at the side of a die.

--- End quote ---
No, not really. There are many techniques for dielectric isolation and the old Harris/Burr-Brown method of fusing wafers in just one. Not really convenient and not really cheap and, according to one TI guy I have read, not scalable to modern large wafers. Supposedly the 21st century way to SOI is deep ion implantation of oxygen atoms and annealing to react them with the silicon.
Noopy:

--- Quote from: magic on July 07, 2021, 06:37:13 am ---
--- Quote from: Noopy on July 07, 2021, 03:53:41 am ---The datasheet describes a ADG444A which is fabricated with an buried oxide layer to isolate the integrated transistors. The isolation prevents latch-up but probably also reduces leakage and crosstalk.

The die doesn´t look like to have this isolation layer.
In the OPA627 (https://www.richis-lab.de/Opamp22.htm) we have seen that it is possible to see an isolation layer at the side of a die.

--- End quote ---
No, not really. There are many techniques for dielectric isolation and the old Harris/Burr-Brown method of fusing wafers in just one. Not really convenient and not really cheap and, according to one TI guy I have read, not scalable to modern large wafers. Supposedly the 21st century way to SOI is deep ion implantation of oxygen atoms and annealing to react them with the silicon.

--- End quote ---

That is a translation artefact. I wanted to say "we have seen that sometimes it is possible to see an isolation layer at the side of a die."
Sorry folks!
softfoot:

--- Quote from: JoergR on July 01, 2021, 08:15:14 pm ---In hindsight, and looking at the pictures now, I feel that the switch chip should be moved over a bit to the edge of the board. The header pins don't need to be below the center of the chip. That would give the capacitors a bit more space. Oh well, ... I'm attaching the KiCad Files if someone still needs those.
I got the DG212 chips today and combined them with 74AC08 AND gates and now the meter is all up and running again.  :-DMM
That's the nice thing about richipedia's design, one can choose different chip combinations DGX12 + 08 AND or DGX11 + 00 NAND on the same board.

--- End quote ---

Are there a set of gerber files for this variant ?? I know I could generate them from within Kicad using the project in the zip file, but I am unfamiliar with Kicad and I'd hate to send off to JLCPcb and end up with rubbish.

Regards,
Dave
Kjo:
The F700013 clone kit is rather east to assemble if you follow the instructions in sequence. It is about as small as possible without a custom IC. It takes me about 30min to assemble one, so the assembled version is a bit more expensive. But it is also tested. I have not seen enough demand to have a shop do the assembly.
Kjo - KO3Y
Noopy:
We have seen this 700013 here:


--- Quote from: Noopy on April 17, 2021, 07:28:10 pm ---...
https://www.richis-lab.de/aswitch01.htm

--- End quote ---




Now I have two older revisions of the 700013 that are in a really bad condition.
I called the first one, the newer one, revision B while this one I will call revision A.
This one was a U301.






Remember the internal construction.
Attention: This is the old die!
I was told switches A and B are dead. Switches C and D can only be controlled by the direkt control through Pin 8.






Now that doesn´t look very good.  >:D
But first things first. That is an older revision than the first 700013 I have taken pictures of. The die has the same size and the structures are quite the same too. I assume it was just an update to fit into a different (new?) manufacturing process.




1982, same as in the first revision. They didn´t change the design year.
684597A, probably an internal naming.
The sunny mountains on the left side have been removed to the later revision.  :'(




The symbols under the mask revisions allow us to check the alignment of some of masks.






Test structures and "the melody" are the same as in the Revision B.




The damage in the control part is significant. The silicon has discolored over a large area and the metal layer has disappeared in several places. I´m not sure what triggered the destruction. The large discolorated areas indicate a longer thermal overload. The GND feed line, which contacts the wide horizontal GND distribution in the center of the control circuit has melted. Destroyed structures can be found where within the circuit the direct control lines of switches A and B arrive. The input circuit for the buffered control line of switch A has been severely damaged. The output line for switch B has disappeared.
The destroyed circuits have no direct connection. I assume that due to an initial fault, the temperature of the die and consequently the leakage currents increased significantly. The uncontrolled current flows then ultimately caused the circuit parts to degenerate.
The destruction fits to the fault pattern of the device. Switches A and B can no longer be controlled because the control circuit is destroyed. Switches C and D can only be controlled by the direct inputs. The buffered inputs are controlled by a circuit in the upper left corner of the die. Due to the massive damage in this area the signal path is blocked.




In the switcher part of the die there is discoloration all over the bondpad area and some of the big switches are damaged. Here we can see one with a molten gate line. Keep in mind, the big transistors are not used in the 700013.
Navigation
Message Index
Next page
Previous page
There was an error while thanking
Thanking...

Go to full version
Powered by SMFPacks Advanced Attachments Uploader Mod