Author Topic: How to eliminate the space between via and copper layer?  (Read 917 times)

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Offline R_ZHTopic starter

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How to eliminate the space between via and copper layer?
« on: November 30, 2022, 08:54:09 am »
Hello everyone,

I'm now designing an adapter PCB using altium designer. I added some vias on the board. I want to reach the effect in 3D model like in picture 1 but I can only get the pattern in picture 2. And in 2D model, when I double click the via, it shows the pattern in picture 3 and 4. Obviously I prefer the pattern in picture 3. I'm new to altium designer and want to know why there is always a crossover shape around the via. I have tried to use 'add stitching to net' to reach picture 1 and I made it, but if go back to the 2D model, there is still a crossover pattern like in picture 4. Does anybody have ideas how to fix this problem?
Any help would be appreciated..

Best regards and thanks in advance!
Runze
 

Offline langwadt

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Re: How to eliminate the space between via and copper layer?
« Reply #1 on: November 30, 2022, 08:57:14 am »
I don't use altium but the key word is;  "Thermal relief"
 

Offline R_ZHTopic starter

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Re: How to eliminate the space between via and copper layer?
« Reply #2 on: November 30, 2022, 10:52:11 am »
Thanks a lot! Yes, you are absolutely correct. I found the answer at Design>Rules>Plane>Polygon Connect Style>PolygonConnect. I set the Connect Style to Direct Connect and I got the results I want. And there maybe some distortion to the via connection to Polygon in some layers after resetting, just redraw the polygon and the problem is gone. Hope this maybe useful for someone who has the same question.
 

Offline T3sl4co1l

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Re: How to eliminate the space between via and copper layer?
« Reply #3 on: November 30, 2022, 11:15:34 am »
Yes, create a new rule, enter the query IsVia (or nowadays, select object type from the drop list, etc.), and set to direct.

If you have a habit of using vias as test points, you may want to add thermals back, in which case sort further based on hole size or TestpointAssy or whatever.  Or use free pads instead of vias, or do both (use free pads AND set rules on them), etc..

(Free pads can be found by (IsPad AND (Name LIKE 'Free-*')), yes, the name is automatically prepended like that and they don't really tell you this anywhere.)

Or similarly for planes, but I would recommend against planes, they've been kind of deprecated for a long time now.  You sometimes still need to use them, but for the most part polygons are better.  (Maybe they've been optimized more in recent versions, I haven't checked, I just never use planes.)

And yeah, polygons need to be repoured.  You can set automatic repour on modify in options.  That can be a bad idea on larger designs though, so YMMV.

Tim
« Last Edit: November 30, 2022, 11:18:06 am by T3sl4co1l »
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Offline R_ZHTopic starter

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Re: How to eliminate the space between via and copper layer?
« Reply #4 on: November 30, 2022, 01:37:11 pm »
Yes, it also works. I just simply changed the default rule and didn't create any new rules, but it's really a better choice to make a new one and leave the original unchanged. Thanks for your better idea!
 


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