There's another post (more of a pissing contest) that mentioned MSP430 and I went over to digikey to find the data and decided to filter on DIP packages. A thought occured to me while applying the filter. How can one chip have so many different packages? I don't know what an 8-SOIC is but I do know what a 14-DIP is and I think I know what an 128-LQFP is. Sticking to what I know, how can a chip's technology be exposed with 14-pins versus 128 pins? I can download the datasheets but that could take me some time to sort that out and I'd guess people here know what's going on. A whole lotta bit flipping??
Just for MSP430 I see these:
Diesale
8-SOIC (0.154", 3.90mm Width)
14-DIP (0.300", 7.62mm)
14-TSSOP (0.173", 4.40mm Width)
16-VQFN Exposed Pad
20-DIP (0.300", 7.62mm)
20-SOIC (0.295", 7.50mm Width)
20-TFSOP (0.173", 4.40mm Width)
20-TSSOP (0.173", 4.40mm Width)
24-TSSOP (0.173", 4.40mm Width)
24-VFQFN Exposed Pad
28-SOIC (0.295", 7.50mm Width)
28-TSSOP (0.173", 4.40mm Width)
32-VFQFN Exposed Pad
32-WFQFN Exposed Pad
38-TSSOP (0.240", 6.10mm Width)
40-VFQFN Exposed Pad
40-WFQFN Exposed Pad
48-BSSOP (0.295", 7.50mm Width)
48-LQFP
48-VFQFN Exposed Pad
49-UFBGA, DSBGA
64-LQFP
64-TQFP
64-UFBGA, DSBGA
64-VFQFN Exposed Pad
80-LQFP
80-VFBGA
100-LQFP
113-VFBGA
128-LQFP