Making ground Plane through the KiCAD

[anso-engineer]

Hello, coming back to the my unresolved design I plan to properly handle power dissipation for TP5000. Actually ground plane is good design practice and as I understand works well for power dissipation purposes also.
Maybe you can share some resources, best pracitces, how to perform it in KiCAD etc. This Ground plane is pretty new thing for me, I plan to get familiar with it more.

[shapirus]

You need to draw a filled zone. There's a button on the toolbar on the right side for that.

Click it, then click outside your board outline, and a window will pop up where you can assign the net (e.g. GND) to the copper, the layer (front or back) and other parameters. Then you'll continue drawing the polygon, and once the shape is closed, it'll result in a copper fill on the layer you chose connected to the net you chose. The (default) hotkey for redrawing zone fills (before exporting, running DRC or opening the 3d viewer) is B.

[anso-engineer]

Great, probably videos I saw on YouTube was in right direction  .
So, if I have 2 layer PCB:
1) 1 layer only for Ground plane, no other nets should be located there?
2) I saw that usually authors of these videos use F.Cu for GND Filled Zone, is there any common standard for this (I thought B.Cu is more suitable)

[shapirus]

Great, probably videos I saw on YouTube was in right direction  .
So, if I have 2 layer PCB:
1) 1 layer only for Ground plane, no other nets should be located there?

Ideally, yes, but you may be forced to route some tracks there, if you can't route them all on the top layer. As a general rule, splits in ground plane should be avoided, so you can, for example, try to route them around the outer perimeter of the board.

For some circuits it wouldn't matter at all, for some it will. The faster the signals, the more important it becomes to have a good ground plane and proper routing.

There's a lot of good educational material on youtube with regards to ground plane and respective do's and dont's, you may want to look that up.

2) I saw that usually authors of these videos use F.Cu for GND Filled Zone, is there any common standard for this (I thought B.Cu is more suitable)

It will introduce additional parasitic capacitance, so watch out for that, if it matters. On the other hand, as far as I understand, it may be used to improve shielding, reduce crosstalk etc. It's a very deep topic.

[PGPG]

1) 1 layer only for Ground plane, no other nets should be located there?

It is the best from EMC point of view. But if you only care about power dissipation than narrow gaps in GND in directions radiating from the heat source will not significantly impair heat distribution.
To get more info about designing PCB for EMC read the articles I have linked here:
https://forum.kicad.info/t/decoupling-capacitor-via-placement/25132/14
https://forum.kicad.info/t/decoupling-capacitor-via-placement/25132/19

2) I saw that usually authors of these videos use F.Cu for GND Filled Zone, is there any common standard for this (I thought B.Cu is more suitable)

If I have footprints (SMD) at top then I use bottom as GND. But sometimes I design PCB with all footprints at bottom and top as GND.
SMD elements you connect at the same side as they are (it would be hard to do it differently). But THT elements you can connect at any side. It helps if GND fill is as close to chips as possible. For THT using top as GND makes this distance smaller.
I am using ferrite beads in supply lines and 47..100 ohm resistors at fast digital outputs. These helps to unravel the connections using only one layer. To preserve continuous GND I sometimes use 0Rs.
Here is my example of 2 layer PCB. There are 3 0Rs. All vias you see are GND.
https://forum.kicad.info/t/approaching-pcb-track-routing-for-a-newbie/36302/8