Mitigating ESD through hotswap connector without chassis ground connection

[t12]

Hello all,

Edit: Changed title cause I read it back and was rubbish.

Currently working on a project, learning a lot as I go. Been reading/skimming the Henry Ott EMC book for answers but my problem is going outside my intuition.

Have attached a picture of the layout and have the following questions, any insight would be appreciated.

Key points:
-Designing a hot swap enclosure which fits into a larger grounded chassis.
-Don't have much/any control over the host enclosure
-The connector between systems does not have a good exterior electrical connection - I could dedicate a couple of pins for connection to chassis ground, but the isolation between this and other signals would be poor (100v), also cannot be sure whether the host system would sensibly connect it to chassis or if it would just connect to system ground regardless.
-I'm trying to rationalise how an ESD fault current would flow from the exterior of the hotswap chassis back to host earth connection
-Power rails and IO

Question:
-How should I provide a ESD path to the enclosure with minimal chance of disruption to device/host?

Option A: Provide direct connection from chassis to ground plane as near to connector as possible
Rationalisation: Low impedance/but not particularly low inductance, full ESD current go through ground and may/may not go through chassis on host side of  connector

Option B: Connect a TVS diode or something else (e.g. surge resistor) between chassis and system ground
Rationalisation: I thought this might help dissipate some energy, but on further thought it probably doesn't, since almost all of the voltage would be seen on ground anyway, regardless of the orientation of the diode. A resistor would loosely couple the grounds and seemingly should reduce the ESD current, but I'm not sure how this would affect the ESD path and/or safety.

Option C: Pseudo isolated grounds, splits, opto isolators, chokes, filters?

thanks in advance...