Ummm, actually, I just used 0.8 because I needed the thinnest boards possible (at iTead). But yeah, I guess it would make it easier to solder the thermal pad.
I've used the same (large via) technique on 1.6mm boards though. Works fine, as long as you build up a good blob of solder and push it down into the via. Keeping lots of flux everywhere, of course.