FS:XRAY Agilent 5DX

[Evolvi]

FS:XRAY Agilent 5DX

Year:2000

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Key Specifications

System Application

The Agilent 5DX Series 3 is designed for In-line Automated
Process Testing of solder connections on PCB assemblies,
with pass-thru or pass-back loading. The system can be used
for all standard joint-types and fully supports inspection of
single and double-sided boards having dimensions up to 457
x 609 mm (18 x24 in.).

Test Approach

Digital cross-sectional X-ray images of solder joints are
automatically generated and analyzed. The analysis results
includes a complete quantitative description of each joint, as
well as a list of all defective solder connections found.
Special confirmation and adjustment routines provide solder
thickness of key solder joint parameters.

Solder Thickness Measurement Repeatability

Solder thickness from 0.05 to 0.25 mm (0.002 to 0.010 in.) can
be measured with a repeatability standard deviation of less
than 4% for all component types except capacitors and
through-hole. Note: the minimum repeatability
standard
deviation is 0.0025 mm (0.0001 in.).

Performance Specifications

Test Speed (joint/sec)

The exact speed depends on the density of the component
layout on the circuit board. Generally speaking, the more
dense the circuit board, the higher the test speed. The typical
range in test speeds is from 80 to 140 joints/second (including
inspection, alignment, surface map, and
board handling time).

Image Acquisition Time
(including movement)

Up to 5 images per second

Load/Unload Time

12 seconds per panel for pass-through
mode, 15 seconds for pass-back mode,
6 seconds per panel using dual loading

Alignment Time

3 to 8 seconds (depending on board size)

Surface Map Time (Points/Second)

Up to 5 points/sec (typical map density is
1 point / 645–2580 sq. mm (1–4 sq. inches)