Nice close-up!
Though, it looks like the solder didn't wet to the PCB pads very well, is it? I was expecting the solder to wet the PCB pads, and to flow more on the PCB pads, too, so to to produce a concave solder joint surface. Here, the final solder surface is convex, in the shape of a half small bubble (on the capacitor's pad).
I'm not experienced enough in SMD reflow, isn't it too little solder paste there?