Hi everyone!
I was wondering if anyone has experience manufacturing this type of stackup, or if it is even possible.
(I'm a beginner btw, sorry if I get any terminology wrong, goes without saying but feel free to correct me)
General idea (see also image attached):
- Top and bottom layers with no copper
- mirrored buried vias between two pairs of inner layers
- It's in a through hole (with 50 mm ~ 1.9685 in diameter)
It is basically two ring electrodes inside the via.
My question is:
- how can this be manufactured. Backdrill, sequential lamination?
- How to specify this in the PCB design (I'm using Altium but I can use others)
I tried searching for sequential lamination here in the forum but only found this, which kind of sugests this could be possible?
a 6 layer board is made as two double sided boards first ( one core each )
so you get
single layer board layer (1)
prepreg
double sided board layer 2 and 3
prepreg
double sided board layer 4 and 5
prepreg
single layer board layer 6
so you can drill 2 to 3 and 4 to 5 as these are each one core.
once that stack is made you can drill 2 to 5 as you have a stack of core 1 (layers 2 and 3) , prepreg , core 2 (layers 4 and 5)
so you can drill that.
then you apply prepreg and foil . now you can mechanically drill 1 to 6
Thanks!!
Yes it can be manufactured, but there will be no through hole at all - internal cores (layers 2-3 and 4-5) are going to be processed first - drilled and plated, after that they will be pressed together with prepreg into the full structure. In your design declare buried vias between layers 2-3 and 4-5 and use them as you normally would vias, just note that they only connect two adjacent layers. Please note that this process is going to incur additional charges as inner cores will need to be drilled and plated independently before pressing them into a final structure - with another round of drilling and plating for "normal" through hole vias to follow. "Talk to your manufacturer" (C) Zack Peterson of Altium
it can be manufactured.
for 6 layer board, 2-3/4-5 is a core. We can dirll 2-3 and 4-5 seperately, then do the pressing 2-5, and drill buried holes 2-5.
fina pressing is 1-6, then drill 1-6 vias.
You can design via2-3, 4-5, 2-5, 1-6 seperately, the PCB engineer can handle it,thanks!
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