That may be true if you chose the same oven temperatures, but if you design for same maximum environmental temperature, the A version has to be set to about 10°C higher oven temperature, which neutralizes the supposed advantage of the A part, because a higher oven temperature requires higher power dissipation in any case.
But if you run the LTZ1000 at 55°C instead of 45°C at 25°C room temperature, the LTZ1000A should still need less power.
Hello,
its not so easy
Most of the heater power is dissipated in the external transistor. (from 14 V power supply I have only around 5V at the LTZ1000 heater).
the 25 deg C environment temperature (for you)
is not the environment (PCB) temperature of the LTZ which is around 8 deg C higher.
with best regards
Andreas
The standard part is the non-A version, which is used for the normal oven temperatures of 45 .. 60°C, which will give typical drift rates of < 1ppm/yr.
The A version on first thought consumes less power than the non-A version.
That may be true if you chose the same oven temperatures, but if you design for same maximum environmental temperature, the A version has to be set to about 10°C higher oven temperature, which neutralizes the supposed advantage of the A part, because a higher oven temperature requires higher power dissipation in any case.
It really depends on your design requirements, i.e. highest possible stability, vs. highest possible environmental temperature, which device you want to chose.
I was trying to say: Higher temperature doesn't mean higher power in any case
Let's assume 25°C ambient temperature:
LTZ1000A (55°C-25°C)/400K/W = 75mW
LTZ1000 (45°C-25°C)/80K/W = 250mW
Urgh, what's going on with the pricing of the LTZ1000? Has Martin Shkreli gone into the electronics business?!?
All of my 7 LTZ1000 references are meanwhile, or even instantaneously stable between 0.3 .. 1ppm/year at about 50°C oven (12k/1k).
All of my 7 LTZ1000 references are meanwhile, or even instantaneously stable between 0.3 .. 1ppm/year at about 50°C oven (12k/1k).
Are they continuously powered? I seem to remember you saying something to the effect that electricity in Germany is too expensive to keep things powered on unnecessarily - and for environmental reasons as well I assume.


I have my 3458's running 24/7/365, but they run at reduced oven temps. Also one unit is LTZ1000CH.
But in my design I prefer to use ACH's.
They also have linear and easily correctable tempco, while CH chips require much dicking around with trims and external isolation just to find that "sweet spot". (My rule of thumb for good LTZ tempco = less than 0.05ppm/K).
Anybody made any measurements to see which numbers are right?
Would those numbers include heat lost via the leads, using a typical PCB layout?
I am looking to insulate the whole reference board and run everything at the same temperature as the LTZ1000 die.
It may have applications in very cold environments where outside temperatures are as low as -50C and high stability with low power consumption, is important.
Where did you get your mentioned >16ppm/°C typical spec Frank?
The drift rate at that temperature of 95°C is nowhere specified, but it is an Arrhenius calculation, according to e.g. P J Spreadbury: 'The Ultra-Zener.. is it a portable replacement for the Weston cell?' , Meas. Si. Technol. 1 (1990).
They demonstrated, that the drift of the LTZ1000 doubles with each 10°C increase of the oven temperature. At 55°C they measure typically -2ppm/year. 95°C would yield a 16 times higher drift.
....
The drift rate at that temperature of 95°C is nowhere specified, but it is an Arrhenius calculation, according to e.g. P J Spreadbury: 'The Ultra-Zener.. is it a portable replacement for the Weston cell?' , Meas. Si. Technol. 1 (1990).
They demonstrated, that the drift of the LTZ1000 doubles with each 10°C increase of the oven temperature. At 55°C they measure typically -2ppm/year. 95°C would yield a 16 times higher drift.
From my experience, it might be a bit better, like 1ppm/year @ 50°C (my 7 LTZs all run between 50..53°C @ 12k/1k) and maybe the 15k/1k gives a bit lower oven temperature, like 90°C.
So my >16ppm/year typ. @ 95°C is really a minimum estimation.
Hello,
my picture of the ageing drift is a bit different.
I think that there are several contributions to drift.
a) the ageing of the zener itself (most probably following Arrhenius law)
mostly depending on diffusion effects and impurity of the silicon.
b) Interaction of the cement with the die (epoxy which is used to fix the chip into the housing).
Here we have very large tolerances from batch to batch and over time.
(thickness of epoxy, viscosity after hardening, changes of epoxy composition due to RoHS and other legislation)
I also think that effects like hysteresis are mostly dependant on the epoxy which is used to fix the chip.
If the sealing of the housing is not 100.0000% hermetically, also humidity can change the epoxy (swelling).
c) Interaction of the epoxy PCB with the chip through the leads.
This one should be small for metal can housings especially with longer leads
but can lead to seasonal changes due to humidity changes/swelling of the PCB.
Practically I have not a large difference in ageing between my 24/7 running LTZ#1 LTZ#2 and LM399#2 (LM399#3 is a bit off with the drift) references.
Although the LM399s are operated at a much higher temperature (90/50 deg C) and should age a factor 16 more than the LTZ1000A.
Hints to the diagram: the jumps on the LTZ1000A references are due to accidently shorts on the unbuffered output.
All measurements are made with a LTC2400 based ADC with temperature compensated AD586LQ reference
(so this reference at room temperature has nearly the same ageing drift than LM399#3) . X-Axis is in days.
