Hi,
Supposing we have a 1.6mm 4 layer (SMPS) PCB (DCDC 24Vin to 12Vout at 3A)
Is it possible to have a 1.2mm FR4 core , and then super thin prepregs around that?
Hi,
Supposing we have a 1.6mm 4 layer (SMPS) PCB (DCDC 24Vin to 12Vout at 3A)
Is it possible to have a 1.2mm FR4 core , and then super thin prepregs around that?
Consider using mega thin prepregs, or even ultra thin prepregs.
you can't use google?
Google doesn't chat to you.
Maybe there's hope when Google introduces LLMs into search results.
you can't use google?
Google doesn't chat to you.
I guess if the intend is not get an answer just but to stir the shit google isn't much help
Thanks, yes , it is out there , as you kindly say..
https://jlcpcb.com/impedance...we are now seeking a 1mm thick board , 4 layers, each 2oz, and no core, just pre-preg separating the copper layers.
But we cant find anybody who does this?
We like it that pre-preg is soft and rubbery and compressable, and we want that, not the tough rigid core.
...
We like it that pre-preg is soft and rubbery and compressable, and we want that, not the tough rigid core.
And the copper tracks, and more importantly, their attachment to the vias?
... and no core, just pre-preg separating the copper layers.
But we cant find anybody who does this?
We like it that pre-preg is soft and rubbery and compressable, and we want that, not the tough rigid core.
So what is the copper attached to while it's etched? Or have you got a way of depositing the individual copper tracks and shapes directly onto the surfaces of the pre-preg?
And what about layer-layer registration? And dozens of other issues?