Just about to reflow a pretty complex board. I've checked the profiles for pretty much all of the components except these:
https://www.digikey.co.uk/en/products/detail/amphenol-cs-commercial-products/RJSSE508001T/4894885. The board is 4 layer with huge ground planes, so I'm going to be at the upper end @ 250 degrees C (~480 deg F) peak. Specific profiles are vague/non existent & I can only see a reference to JEDEC-020C and UL 94V-0. Anyone used these before with lead free? I'm planning on SMD291SNL250T5 paste.
Note: Reflow soldering peaked at 260⁰C for 10 seconds max for the shielded, mine is unshielded. Time for metalic tape?
The Amphenol website has a full product specification with reflow profile.
Did you look there or contact Amphenol? Don't rely just on the distributor provided data.
It does state
Recommended Soldering Temperature
Lead free reflow soldering up to 260⁰C for 10 seconds (refer to reflow profile below, maximum of 3 reflow passes permitted)
https://www.amphenol-cs.com/product/rjsse508001t.html
The described profile is nothing special, nothing should really be going over 260C anyway in normal circumstances. Of course if you are running a shitty tabletop IR oven you could have nasty hotspots and plastics tend to have a bad day.