If it's hand soldered, it doesn't really matter.
I don't mind HASL for smaller footprints, for the above stated reasons. Larger components, it's more risky, and you're probably doing finer pitch and more pins thereof, in such a design, for which ENIG may be desirable.
I'd be more concerned about poor centering from that copper bridge between pads. Better to use thin trace segments to fan out the footprint, then connect to wide trace/pour. In general, solder mask does not align with copper, and this way the pads can be non-soldermask defined (NSMD) with excellent alignment.
Tim