Most MCUs have some sort of curves for MHz vs Vcc, and you can infer the temperature effects by comparing the same-die in differing temps specs.
Well, yes, but this basic inference is not what mean.
Let's say we take a sample of N=10,100,... MCUs and run all of them at certain voltage and frequency in temperature stabilized environment.
And we measure the time from power up to when a test firmware produces bad result or stops responding or otherwise diverges from other samples.
Then we plot mean time before failure with error bars against frequency at const voltage and const temperature t(f)|const V,T;
Then we also plot t(V)|const f,T; then t(T)|const f,V for all (f,V,T) points on a grid.
Eventually we end up with a 3D distribution <t>(f,V,T), and considering measured error also with <t>-e(f,V,T) and <t>+e(f,V,T).
It is interesting to see what this function looks like and what slices along coordinates and paths withing this (f,V,T) volume will look like.