(even though they are not explicitely marked as ceramic, we can assume they are)
Not if OP's asking.
If I replace the two electrolytics (C2 & C5) with SMD ceramics of the same capacity, will there be any problem?
Well. Dunno if we talk about the same thing, or understand each other.
The OP has put ceramic caps (100n, 10n) for decoupling, we can assume he's going to put them close to the IC. This is just what ST suggests. The reason is they have very low ESR and behave reasonably well at high frequencies, so they are better than electrolytic caps for just that.
I admit the OP's schematic is a bit ambiguous though, as the electrolytic caps are drawn closer to the IC - he should move the ceramic bypass caps closer to the MCU to make it clearer, although it's not strictly required (some people even put their bypass caps separately in their schematics, I don't like it, but hey...)
There's no problem adding larger caps, on top of that, as electrolytic or tantalum caps, though. But yes, you'd typically place them further away. So I guess our misunderstanding comes more from the "drawing" style than from the schematic content itself, which to me was correct. Then the question would have been the layout. But maybe you were able to "read" from the OP's posts and drawing style that he was going to get the layout wrong.
For simplication, for VDDA, I would personally just replace C4 and C5 with just ONE 10µF ceramic cap (this is what I usually do). Of course as close to the MCU as possible. As for C2, it's probably useless here, but it won't hurt. Just place it closer to the power supply connector than to the MCU.
As there is only one VDD pin, I would also get rid of one of the 100nF caps. Only one is enough.