Author Topic: Different die pictures  (Read 183621 times)

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Offline NoopyTopic starter

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Re: Different die pictures
« Reply #500 on: May 15, 2026, 10:47:34 am »
That means I was lucky to wait only one year? >:D :-DD

I have parts which are way older!  ;D
...but I always say: Tell me if it is urgent and tell me again a few weeks later.
Some parts are still interesting even two years later. This flexibility helps me maitain efficiency. Publishing a new part every 2-3 days, all year long, is dificult to to maitain as a one-man operation.

Offline NoopyTopic starter

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Re: Different die pictures
« Reply #501 on: May 21, 2026, 02:58:26 am »

...






I have taken a closer look at the ROM of the EA7044. It consists of 29 columns and 88 rows. The column select lines are located at the bottom edge. The first three address lines, with their inverted potentials, form the typical structures. The fourth and fifth address lines continue this pattern. However, their geometries have been slightly modified to save space.

In the memory area, a line with a fixed potential (yellow) is always surrounded by two data lines (green). The data lines are connected to a high-impedance potential (purple) at the left edge. The programming determines whether a gate oxide region is located above the green-yellow line pairs. With a gate oxide, the potential of a column can conductively connect the lines. As a result, it is no longer the purple potential but the yellow potential that is transmitted to the right.

Column selection uses three address lines with their respective inverted potentials. In this way, one column is selected from eight columns. The data interface is thus 11 Bit wide. Virtually, this results in a 232 x 11 Bit ROM.


https://www.richis-lab.de/calc18.htm#mem

 :-/O
 
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Offline Renate

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Re: Different die pictures
« Reply #502 on: May 21, 2026, 05:24:00 am »
Hmm, this got me thinking about addressing.
Of course for RAM you can shuffle the rows and columns as you like.
With ROM you can too, but it complicates the data layout.
Have you ever seen anybody using Gray code for layout?
That would give you the benefit of reducing the zigzaginess of the address zero and one fanout by a factor of two.
Not that that seems to be a problem.

 

Offline NoopyTopic starter

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Re: Different die pictures
« Reply #503 on: May 22, 2026, 03:04:10 am »
Hm, no, I don´t think I have seen a Gray code adressing.
But that´s an interesting idea...

Offline NoopyTopic starter

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Re: Different die pictures
« Reply #504 on: June 08, 2026, 03:11:57 am »


The LIT-2102 is a calculator controller manufactured by the American company Litronix. The package material resembles a gray compound that is more reminiscent of hard silicone than epoxy.




A silicone potting protects the die.




The LIT-2102 contains a die measuring 4,6mm x 4,7mm.

This image is also available in a higher resolution: https://www.richis-lab.de/images/calc/23x03XL.jpg (185MB)




The design appears to be built by Litronix, dating back to 1974.




The number sequence 2102 and its placement in two levels suggest that there is an overarching basic design for the LIT-2100 family and that the LIT-2102 is a variant of it. The lower mask defines the different functionality. This mask determines either where contacts are formed or where a gate oxide should be located.




On the right edge, the letters “US” appear to have been placed one below the other three times. The letters are not immediately recognizable, partly because they are integrated into the circuit as functional components.




The revisions of five masks are shown to the left of the RAM area. The characters 4C have been joined together to save space.




In the lower section of the die, it was clearly a struggle to route the traces.




The LIT-2102 is very similar to the LIT-2314 (https://www.richis-lab.de/calc14.htm). Upon closer inspection, however, a few differences become apparent (list is not exhaustive):

The space required for the output stages at the bond pads has been slightly reduced compared to the LIT-2314. The circuitry in the upper right area has changed significantly. In the case of the ROM (upper left), not only has the surrounding circuitry changed, but also the memory depth. The LIT-2102 has 64x64 memory cells, while the LIT-2314 operates with 96x64 memory cells. The RAM (top right) has also been modified. The memory depth differs slightly in the upper and lower sections. Circuitry components have also been changed along the lower edge.




The LIT-2102 shown above was removed from the Privileg 861-M-NC calculator pictured here.




The LIT-2102 is located above the display. The LBC-1080 next to it is not just a segment driver; it is a special auxiliary component.




Here is a second LIT2102. Upon closer inspection, you can see an irregularity in the center of the package.






It appears that the irregularity was caused by an excessive amount of silicone. The package material was so thin at this point that it could no longer form a stable layer. From a durability standpoint, this is a major problem, as many substances can diffuse through silicone. It protects the die only from mechanical influences; the package material must provide protection against environmental influences.




Silicone is very difficult to remove without leaving any residue. So-called silicone removers only loosen the silicone; they do not dissolve it. Silicone residue between the circuit traces is particularly stubborn.




No differences can be detected between the two LIT-2102.

This image is also available in a higher resolution: https://www.richis-lab.de/images/calc/24x05XL.jpg (117MB)


https://www.richis-lab.de/calc20.htm

 :-/O
 
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Offline NoopyTopic starter

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Re: Different die pictures
« Reply #505 on: June 08, 2026, 03:13:05 am »


The Litronix LBC-1080 is a peripheral device designed for use with the LIT-2102 calculator controller.




The die measures 1,7mm x 2,0mm. It is therefore significantly larger than the die of the LBC-1082.

This image is also available in a higher resolution: https://www.richis-lab.de/images/calc/25x02XL.jpg (43MB)




Here is another LBC-1080.




This die appears to have exactly the same structure as the first die. The surface is less damaged.

This image is also available in a higher resolution: https://www.richis-lab.de/images/calc/26x02XL.jpg (42MB)


https://www.richis-lab.de/calc21.htm

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Offline NoopyTopic starter

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Re: Different die pictures
« Reply #506 on: June 16, 2026, 03:32:58 am »


The AB5301A is a microcontroller optimized for audio applications from the Chinese company Bluetrum, founded in 2016. It features a 125 MHz RISC-V processor with 1 MB of flash memory and 190 kB of RAM. In addition to a radio receiver and various audio signal channels, it also includes a Bluetooth interface.

Bluetrum microcontrollers are known for having lettering that often have nothing to do with the component designation. This is also the case here with the string CTXC14B5A. The datasheet contains no explanation of how to interpret the lettering.




There are two chips inside the package. The upper chip is the AB5301A's flash memory.




The microcontroller measures 2,3mm x 2,4mm. RF circuitry is located at the top left and bottom right. The area at the top left must represent the Bluetooth interface, as the same structures are found on the BT8922H2 (https://www.richis-lab.de/uC11.htm). The BT8922H2 appears to have a very similar layout.

This image is also available in higher resolution: https://www.richis-lab.de/images/uC/15x03XL.jpg (63MB)




The design incorporates multiple layers of metal. Nevertheless, interesting structures can be seen in some areas.

This image is also available in a higher resolution: https://www.richis-lab.de/images/uC/15x04XL.jpg (12MB)




This image is also available in a higher resolution: https://www.richis-lab.de/images/uC/15x05XL.jpg (11MB)






These inductors with their specialized geometries are commonly found in integrated circuits that process high frequencies.




The flash memory chip measures 1,2mm x 1,0mm. The markings indicate that the chip was manufactured by UCUN Technology, a Chinese company founded in 2018.

This image is also available in higher resolution: https://www.richis-lab.de/images/uC/15x08.jpg (11MB)




The top section shows the memory controller. Below that, you can see the uniform, very small structures of the memory itself.

This image is also available in a higher resolution: https://www.richis-lab.de/images/uC/15x09XL.jpg (6MB)


https://www.richis-lab.de/uC15.htm

 :-/O
 
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Offline NoopyTopic starter

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Re: Different die pictures
« Reply #507 on: June 18, 2026, 03:13:14 am »


The AB5322B is very similar to the AB5301A. It features a 125 MHz RISC-V processor with 512kB FLASH and 124kB RAM. The audio area has "less channels".




The microcontroller measures 2,0mm x 2,2mm. The IC closely resembles the AB5301A, but is slightly smaller. As said the AB5322B has fewer audio channels but particularly noticeable is the absence of the large inductor in the lower right corner.

This image is also available in a higher resolution: https://www.richis-lab.de/images/uC/16x02XL.jpg (47MB)




The FLASH memory measures 1,0mm x 0,5mm. It is a part from Puya Semiconductor designated PY1905V1.

This image is also available in a higher resolution: https://www.richis-lab.de/images/uC/16x03XL.jpg (11MB)


https://www.richis-lab.de/uC16.htm

 :-/O
 
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Offline NoopyTopic starter

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Re: Different die pictures
« Reply #508 on: June 21, 2026, 03:43:29 am »


The FR1001 is a calculator controller manufactured by the American company Frontier.




The grayish package material leaves stubborn residue on the die.




Unfortunately, the necessary mechanical cleaning leaves a few scratches, but at least the residue can be completely removed when viewed from the surface. The die measures 5,3mm x 5,5mm. The large, elongated elements on the top and right edges are shift registers. Equally noticeable are the wide, mostly horizontal metal strips, beneath which the logic’s resistors are located.

This image is also available in a higher resolution: https://www.richis-lab.de/images/calc/27x03XL.jpg (125MB)




The upper edge bears the designation FR.1001 and five symbols. ST, DC, HH, and KO could be the developers' initials.




Various test structures have been distributed across the edges. Three different MOSFETs can be seen here. The numbers .4, .5, and 4.2 indicate the gate lengths in mils (thousandths of an inch). Multiplying these by 25,4 gives the length in micrometers.


https://www.richis-lab.de/calc22.htm

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Offline NoopyTopic starter

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Re: Different die pictures
« Reply #509 on: Yesterday at 03:38:02 am »


Here is a printed sticker that has an RFID transponder on the back. The interior of the antenna structure resembles a UFO, which is reflected in its name. UFO70 is the abbreviation for the RFID-ST-U-UFO703M from the Thai company Smart Identify. The datasheet reveals that the transponder IC is an NXP UCODE 8.






The actual RFID transponder is located in the upper part of the “UFO,” on a small cut in the metallization. The two circles likely make it easier to position the small IC.




The IC itself is coated with a polyimide layer that carries two large and two smaller contacts.The datasheet states that the smaller contacts serve solely to better match the transceiver to the antenna impedance. Removing the upper layers is not easy, as the contacts stabilize the polyimide. Furthermore, it is generally difficult to mechanically process the surface of such a small die.




The die measures 0,49mm x 0,48mm.

This image is also available in a higher resolution: https://www.richis-lab.de/images/transponder/07x05XL.jpg (16MB)




A little bit better than my old picture of the UCODE 8...  ;D




The design dates back to 2018.


https://www.richis-lab.de/transponder07.htm

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Offline Ranayna

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Re: Different die pictures
« Reply #510 on: Yesterday at 01:59:52 pm »
[...]
The die measures 0,49mm x 0,48mm.
[...]
That makes me wonder: How thick are the blades of the saws used to cut the wafer into individual dies usually?
 

Offline NoopyTopic starter

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Re: Different die pictures
« Reply #511 on: Yesterday at 04:07:07 pm »
[...]
The die measures 0,49mm x 0,48mm.
[...]
That makes me wonder: How thick are the blades of the saws used to cut the wafer into individual dies usually?


https://www.enas.fraunhofer.de/en/departments/SP/services/dicing.html
Quote
The thickness of such a blade defines the dicing width and blades from 15 µm up to 500 µm can be used.

But today there are also these laser diving technologies:
https://www.disco.co.jp/eg/solution/library/laser/laser.html


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