The non-electrically isolating gap pads can have much better thermal performance and can get away with being much thinner etc so are useful when you already have electrical isolation via the package, something like that fully encapsulated TO-220 variant I can't remember the name of or one where the IC is bonded to an aluminium oxide insulator like most IGBT modules tend to be, or even microcontrollers/processors and misc ICs etc
There is a variety of silicone based pad (I think) made by Bergquist/Henkel, intended for both electrical and thermal conductivity, the performance of both relies on pretty high mechanical pressures so it wouldn't measure particularly well when not compressed.