Here is my question. I have been trying to do a little research as I am not an expert in EMI, PCB design, or return currents. The 15022 FFC cable has what they call a "grounding tape" as part of the stack up. I was thinking to myself that I could get rid of the GND pins between pairs and just use the grounding tape for the return currents. That way they are directly underneath the pairs. It also lets me go with a smaller pin count interconnect. I talked to my hardware guy briefly and he said that the grounding tape is for shielding and should not be used for return currents.
Whether the shield "should" be used for return currents is an odd question if you intend to use LVDS. LVDS should be fully balanced, therefore each pair acts as its own return path.
The grounding tape definitely affects the differential impedance, and provides some level of shielding. If it's acting as a return current path, that's not necessarily bad in itself, but it begs the question of why a return current exists in the first place...
Can I use the grounding tape for return currents (same GND connection at both ends to PCB GND) or would I still have to keep the GND-SIG-SIG-GND pin lineup? Am I only supposed to use the grounding tape as a shield and connect to a SHIELD pin at one end?
The pinout (Sp-Sn-Sp-Sn vs G-Sp-Sn-G) will affect crosstalk significantly, and also the impedance to some extent. I would expect Molex to provide some data on this, but I have yet to find anything on their website. They just state a differential impedance of 100ohm +/-10%. Nothing about crosstalk or attenuation, or what pinout is used for characterization. Can't really make any suggestions without more data...