Incidentally, GaN isn't very useful above about 100W per power stage, due to physical size constraints.
That is: the switching loop inductance is proportional to physical size of the layout. This inductance combines with switch capacitance to give a characteristic time constant / cutoff frequency, and impedance, of the power stage. If that impedance is very far from the load impedance (Vsupply / Ipeak), it is at risk of being excited by switching transients, where destructive peak voltages or currents ensue (voltage being the critical one, most times).
High voltage GaN helps with this, since their capacitance is already quite low and the tolerable inductance is that much higher. Still, it can't go much beyond the low kW, at least right now.
In any case, needless to say, layout is critical here. Two-layer boards are nearly useless. Don't play with GaN unless you're playing with 4+ layer boards!
This is not news by any means -- it already applies to silicon devices, this being the limiting factor against large MOSFET modules, say. They are available in lower ratings, but IGBTs take over in the 100s of amperes range. Speed also isn't a big priority in high voltage converters, to a point (although right now, the limiting factor is definitely the device -- in 2kV+ devices, minority carrier lifetime is multiple microseconds, and we'd be happy to have that a bit under 1us).
This is fundamentally why, for example, commercial FM transmitters are made from myriad blocks wired together: small amplifiers, running from modest supplies, all working together to generate the final (~50kW?) output.
Likewise, power converters, operating at high frequency, must be divided into a multi-channel design (usually multi-phase, for the inverse reason why the broadcast transmitter is multi-channel and in-phase!). This, too, already affects silicon, but also inductors and capacitors which are otherwise impractical at scale (hence the N-phase Vcore supplies on PC motherboards, GPUs and such).
Tim