**turns out its hidden under a FR4 sleeve**
This HP 6177B I am restoring specifies a BN thermal pad for a TO3.
I see my unit has what looks exactly like PCB thermal pads for the TO3 transistors.
I figure while not as nice as BN, standard Alumina might be a bit better then fiberglass PCB material.
Is there some sort of special PCB look alike thermal insulator pad, or did they just use FR4 instead of boron nitride?
Since I assume it works with what looks like FR4, while not boron nitride, Alumina will be alot better of a conductor at a similar thickness (its a thick PCB). I don't want to deal with BeO.
Am I missing something? It seems kinda big deviation to go from boron nitride to what looks like a circuit board cutout. AFAIK Its not been touched.
I guess its not important, but damn thats some chainsaw killer cost cutting to replace specified boron nitride with FR4. I wonder if someone wrote a death threat on the change notice on this one
the insulator mafia?? it went from 30-50 to 0.3 watts heat conduction. shift the decimal two places over
its thick too, like 2.5mm. Anyone else think that this is pretty savage??
Could it have something to do with stability and thermal insulation though??? but then why put the heat sink. did this unit have some kinda problem they found late in production?the change notice says
A boron nitride insulator (HP Part No. 0340-0411) has been installed
under Q25 before mounting it On the Heat Sink.
which agrees with the parts list.
but it does not agree with the PCB insulators I see on my unit.