as a packaged IC device would be Within the package sourced from input so positive would be powering a thermal package controlling the mosfet drive on the same chip or lithographed IC passive power consumption through driver circuit in parallel to mosfet and mosfet clamping 0hm-infohm.
But this in my mind more of a bi-layer polymer based specialized Semi conductor sandwich Material wizard design. As simple as a film resistor on outside but yes functions like a 2 pole mosfet controlled by magic (resistance curve based on temp whether by liquid metal, materials, capacitive gap ect etc).