When capacitance matters (and often it does), strongly recommending only using parts for which DC bias effective capacitance curve exists, so you can check what you actually get. Then you can choose - if both ESL (small size) and large amount of capacitance are important to you, then you can pick the smallest size which gives enough actual capacitance. Or compare µF/$ or whatever.
Inferring/guessing the true capacitance curve from other parameters is last resort and you really need to know how to do that. The most usual mistakes (due to incorrect advice all over the internets) are thinking that temperature rating codes (like Y5V / X5R / X7R), often semi-incorrectly/misleadingly called "dielectric types", have any predictable correlation with the DC bias curve; and that voltage rating has anything to do with it. Former has weak-but-existing correlation, latter even weaker.
In absence of real data, best indicator for how much capacitor is losing capacity is indeed volumetric energy density - how large is the nominal capacitance to begin with compared to package size (remember to include height) - if something is "too good to be true", it probably loses more capacitance under the bias, than one with smaller claimed (nominal) energy density.
So forget all the "X7R loses 50% of capacity under rated voltage, Y5V loses 80%" crap you can find online. It's easy to find examples of X7R parts that lose 80% and Y5V parts that only lose 70%. These tags are by definition temperature dependency curves, not DC bias curves.
ESR / current capability is problem only in most extreme cases.
At 3.3V, sensible minimum package sizes for 4.7uF, 10uF and 22uF would be maybe around 0603, 0805, 1206 respectively. Rough ballpark. E.g. 10uF in 0402 would probably lose a lot of capacitance at 3.3V bias. Also remember that paralleling smaller parts is sometimes better, depends on your layout.
4.7uF 0805 for ~10-20V, 10uF 0805 for <5V would be a good golden middle road start - for more capacitance, you can parallel those.