I'm still sceptical of the effectiveness of the silicone so far off the sides. Most of it is just touching the leadframe, which is rigidly soldered, and not the inductor body. You usually see silicone being used in larger components where leads can bend significantly in relation to the component body, and the silicone is then applied between the board and component body (not the leads, like in this picture).
When SMD parts need added mechanical support, one usually sees one of the two:
1) underfill for parts like BGA packages, this is thin polymer fluid which is applied after assembly right next to the component and flows by capillary action into the small gap, totally filling the voids between the component and PCB, and then is cured using heat
2) glue which is applied to the board by a CNC dispenser in small dots, before pick&place, which is cured during reflow.
Both are almost impossible to see from the finished board.