Author Topic: PCB Review: First Radio Project  (Read 961 times)

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Offline derGraphTopic starter

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PCB Review: First Radio Project
« on: January 22, 2022, 07:42:16 pm »
Hello,
My Name is Paul and I am a higher Secondary Student on a electrotechnic focused school.

I found this really cool RF Transceivers from TI. It is the CC112x Family and now im trying to design a PCB around it. I found the BALF wich is, in a nutshell all the passive components that would be needed. Can some of you more experienced Volks take a glance over it. The BALF is connected exactly like the datasheet states and the output to the antenna should be impedance matched to 50 Ohms. I did this with the Layer Stack Manager.

Thanks,
Paul

 

Offline derGraphTopic starter

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Re: PCB Review: First Radio Project
« Reply #1 on: January 22, 2022, 10:58:53 pm »
Thanks for the help, I implemented some of your Tips and will send this PCB of soon.
 

Offline Bud

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Re: PCB Review: First Radio Project
« Reply #2 on: January 22, 2022, 11:56:21 pm »
As an RF best ptactice , run separate grounding vias right next to each component that is grounded, do not run a bus grounded with a single via. And if space allows, make 2-3 grounding vias for each component.
When will be soldering, solder the SMA connector last, otherwise it will suck much of heat and you may have difficulties soldering other components close to it.
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