Many high performance RF IC's use open bond wire construction techniques. Nothing hobbyist about them
If you open those nice solid looking RF amplifier modules from Avantek or similar you will often be faced with the horror of a silicon wafer on Ceramic substrate and fine gold bond wires. Not something I could repair even if I could lay my hands on the failed chip. The bond wires are in an air dielectric, far better than passing through a plastic or ceramic shell. No need of such in modules that are sealed, and so protected. These chips are just basically a die and its associated bond wires minus the consumer friendly housing and pins/pads.
Thanks for sharing the images. As has been stated, do not buy one of these types of probes untested, they are not really a DIY repair proposition for the hobbyist. Physical damage to the case, repair of the scope end, yes.....repair of the probe head .......
nope.
People sometimes wonder why high performance microwave frequency modules cost so much. It is not just the physical component cost, it is often the equipment and technicians time to hand tune and test the module during production. Some of these modules need quite a lot of skilled 'tweaking' to ensure that they meet the specification. I knew a chap from Marconi who told me that they used Hewlett Packard test gear on their microwave test benches as it was the Best. They often found that their own microwave test gear barely met spec, yet the HP stuff far outperformed basic spec. Quality kit, no doubt about it. Sadly I can't afford such quality in my lab so I make do with Marconi, R&S, and Advantest RF test gear.
Aurora