EEVblog #1029 – BGA PCB Fanout

Dave looks at some issues with fanning out tiny 0.4mm pitch BGA packages, via pad and hole size, tenting, breakouts, solder mask expansion etc.
And then compares it with an 1136 pin Xilinx Virtex 5 FPGA with 1mm pitch to show the difference in PCB process technologies needed.

Forum HERE

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