I think this thread is about TI's corporate malfeasance that we all are finding unacceptable.
What happens is executives and employees worship the scorecard and it becomes a bad corporate culture. It always gets worse with time until the plane crashes.
Cost improvement doing a die-shrink results in weaker power transistors - reduced SOA and less heat transfer to the frame.
It shows up in the NE5532's weaker output stage that TI puts the "lipstick on a pig" by deleting any such revealing specs. 600 ohm drive is a basic requirement in pro-audio for many decades.
It shows up in the
LM317M SOT-223 "new chip" thermal resistance 30% worse than the legacy part. Maybe they even saved a milligram of metal. You won't get "900mA" for long, test unknown, probably "new chip" does it for only a few usec lol.
Die-shrink surely the comp caps are smaller and challenge stability as well.
I have to swear here, the OPA134 is fuckin' over 15x the price of the NE5532! Overpriced that cow did you?
Nevermind TI's bastardization and ruining of the Burr-Brown designs, it's a travesty taking their innovations and enshittifying them, all the while jacking up the prices.