got my batch of boards this morning, so a 5 day turnaround, looking very good,
I'll whip the old camera out tomorrow, but for now i'll run down the basics,
Pad adhesion - normal soldering, even holding the iron in place at 350C for 30 seconds does not effect it, but rotational forces while hot can cause the pad to slide while still being adhered while cold, I only noticed this on an 0603 pad, however it appears its slightly weaker than say a recent Itead board, Possibly a concern for hacked together projects,
Hole registration is fine on 0.3mm hole, 0.6mm pad vias, the tenting has voids on a small fraction, but no copper is ever exposed.
plated hole wall thickness is slightly thicker than 0.5oz, at-least by material mass, uniformity on this kind of aspect ration is good, no signs of plugging or partial voids. the material is bonded in the holes far stronger than it is bonded to the board itself, likely due to the increased surface area.
Silk screen is readable, but slightly distorted on 0.5/0.5mm text,
Edge routing shows that they internally use mouse-bites on a 2mm routing bit, the bumps were filed, but not filed flush, for the price I don't mind, but something to be aware of it you need exact dimensions.
solder mask was expanded out to roughly 0.1mm expansion around both 0.5mm QFN package pins, and 0.65mm MSOP packages,
The 1.6mm board material appears to have an Er of about 4.3,