What is the thing with DIP? Are they still being used by any mass produced products?
The only DIP chips I can still think of are DIP4 optocouplers and DIP8 integrated flyback SMPS chips.
If you want to use a single sided SRBP PCB, as many whites goods makers still do, DIPs are the prefered package.
Just use an SOP as a DIP. Fan out the pins and it's virtually a DIP, without the high package material cost and manual part insertion cost.
DIPs can be placed automatically for decades.
Don't think that's true for China, or maybe I'm wrong.
In my mind, automatic THT placement is expensive and prone to failure, way more expensive than SMT.
Modern single layer PCBs usually consist of largish SMT parts glued on the bottom including ICs and through hole parts and jumpers on the top. Like electrolytic capacitors, power semiconductors, optocouplers. All of it is wave soldered, no reflow. If it's simple circuit, it may be through hole only as well.
Modern single layer PCBs usually consist of largish SMT parts glued on the bottom including ICs and through hole parts and jumpers on the top. Like electrolytic capacitors, power semiconductors, optocouplers. All of it is wave soldered, no reflow. If it's simple circuit, it may be through hole only as well.
if it has bunch of big connectors you might have to do wave solder any way so going all through hole might same a few steps
DIPs can be placed automatically for decades.
Don't think that's true for China, or maybe I'm wrong.
In my mind, automatic THT placement is expensive and prone to failure, way more expensive than SMT.Automated through hole placement is slow and easy to screw up. I don't think it 100% of parts are automated even at places with machine placement.
I visited a TV manufacturing plant from Nokia in Germany in the early 90's and even back then they placed all through-hole components automatically. The machines would even detect a failure, pull the part back out (bin it) and re-insert a new one. I'd say those through hole placement machines where more impressive than those newfangled SMT p&p machines
The SMT parts where glued to the solder side and the whole PCB would then go through the wave soldering machine.
DIPs can be placed automatically for decades.
Don't think that's true for China, or maybe I'm wrong.
In my mind, automatic THT placement is expensive and prone to failure, way more expensive than SMT.
Absolutely smallest and cheapest won't have core-coupled RAMs, of course.
QuoteAbsolutely smallest and cheapest won't have core-coupled RAMs, of course.If you meant the "Tightly Coupled Memory" (TCM) feature provided by ARM, that's an OPTION in CM7, not available at all in CM0 through CM4.
What is the thing with DIP? .... For the sake of love, I've not used a DIP for years, literally years, besides student teaching projects.
PS. Also why TSSOP? They are harder to hand solder than DFN/QFN. The gull wing sucks and stores solder, so bridging happens all the time with short pad extension. With QFN, I can do 0.2mm extension per side and they still don't bridge.
Well, this post certainly wanders all over the place ;-)
QuoteAbsolutely smallest and cheapest won't have core-coupled RAMs, of course.If you meant the "Tightly Coupled Memory" (TCM) feature provided by ARM, that's an OPTION in CM7, not available at all in CM0 through CM4.
I bet by the time you used your first SMD chip, other people had been using them for years, literally years.
The reason, as far as the manufacturers are concerned, is because of branding/marketing/education. If some n00b chooses TI over Maxim IC because it comes in DIP, he might end up buying hundreds of thousands of (SMD) TI parts in the future, just because that's what he is familiar with.
At least one practical reason is that QFN are more culpable to cracked solder joints due to board flex and/or thermal expansion/cycling. The difference has been tested. And regarding deep thermal cycling, apparently gull wing chips can be more than an order of magnitude better in some of these tests.
QuotePS. Also why TSSOP? They are harder to hand solder than DFN/QFN. The gull wing sucks and stores solder, so bridging happens all the time with short pad extension. With QFN, I can do 0.2mm extension per side and they still don't bridge.At least one practical reason is that QFN are more culpable to cracked solder joints due to board flex and/or thermal expansion/cycling. The difference has been tested. And regarding deep thermal cycling, apparently gull wing chips can be more than an order of magnitude better in some of these tests.
I visited a TV manufacturing plant from Nokia in Germany in the early 90's and even back then they placed all through-hole components automatically. The machines would even detect a failure, pull the part back out (bin it) and re-insert a new one. I'd say those through hole placement machines where more impressive than those newfangled SMT p&p machines
The SMT parts where glued to the solder side and the whole PCB would then go through the wave soldering machine.
I visited a TV manufacturing plant from Nokia in Germany in the early 90's and even back then they placed all through-hole components automatically. The machines would even detect a failure, pull the part back out (bin it) and re-insert a new one. I'd say those through hole placement machines where more impressive than those newfangled SMT p&p machines
The SMT parts where glued to the solder side and the whole PCB would then go through the wave soldering machine.
Yes, they are truly impressive, like the Panasonic AV132 puts components in like good old chip-shooter places chips at 30000 per hour or thereabout. They just appear on the board faster than eye can see!
Though I still see the center pad of QFN's a right pain to get right every time, you have to generally get weird with your paste masks to get better than 99.9% yields, which generally leads me to fitting a dot when its needed, vs a full pad,
Yes, they are truly impressive, like the Panasonic AV132 puts components in like good old chip-shooter places chips at 30000 per hour or thereabout. They just appear on the board faster than eye can see!It's nowhere near to fully automated TH component placement. All it places are axial parts with 2 leads like resistors.
Clearly, it's ST's addition, and not the "ARM's option". The name is "CCM" for core-coupled memory instead of "TCM".
Really, entire world? Then why new parts still appear no the market?QuoteSemiconductor MCU revenue market forecast –millions of dollars