When an unloaded single 74HC gate switches it pulls a current spike of about 40mA, more if there is significant capacitance on its output. If you have a significant number of gates switching at the same time with a common ground connection, even a few tenths of an Ohm extra resistance can cause serious problems. e.g. if its a MSI logic function using 10 simple gates, it could pull several times that current while switching. (Not 10 times as purely internal gates will use smaller transistors.). Take 10 such ICs without adequate decoupling right at each IC and good grounding, clock them synchronously, and you can easily get 1A peak transients in the supply and ground wiring. The combination of inductive coupling disturbing input levels and ground bounce due to excessive connection resistance and lead inductance can easily use up all your noise margin and cause other inputs that *should* be a steady level at that clock edge to glitch.
The cure is local decoupling directly across the Vdd and Gnd pins of *EVERY* IC to keep the switching transient currents out of the supply rails, and a low resistance, low inductance ground, usually a ground plane to minimise ground bounce. As it isn't practical to use a ground plane with solderless breadboards*, the best you can do is a heavy copper wire grid or mesh, with each intersection soldered, running round the edge of each breadboard section with short 'pigtails' soldered to it then plugged into each end of each ground bus strip.
* Unless you go to the extreme of taking an Xacto knife and cutting and stripping the self adhesive insulation strip from the back of each ground bus strip, then applying self-adhesive copper tape (with a highly conductive adhesive) over the whole back of each breadboard, or applying anisotropic conductive tape to each ground bus strip then sticking all the boards down on a tinned copper sheet.