Yeah looking at this one it's definitely a possibility. The main divider network is ok which is the difficult one and the second one is just a bunch of close tolerance standard values. I reckon I can knock something up on JLCPCB and use 0.1% or better SMD resistors.
The issues will be thermal tracking and any residual stresses in the resistors either after soldering or due to differential expansion when the temperature changes. Thermal tracking can be minimised by hillbilly engineering. I don't know the significance of the the stresses, but through hole will be better. For an extreme example, I refer you to -group-therapy-thread/?action=dlattach;attach=791394)
It seems to me that anything made from phenolic resin PCB & SMDs would be no more thermally co-reactive (most likely less so) than the original, which was made of thin-film resistors & silver traces printed on a thermally conductive ceramic substrate. Am I missing something here?
Ceramic and silver traces are much more stable and predictable than FR4 + ceramic(?) SMDs.
The original would have been professionally designed, including consideration of coefficients of expansion.
The original would have been professionally manufactured, with known components and temperature profiles.
How much that matters in this specific case is left as an exercise for the student.
Wasn't saying you're wrong, just saying that obviously there's considerable thermal co-reactance in the original design, which may or may not have been accounted for. Remember too that the obverse is true; thin-film printed resistors of this sort were a new technology and the precision & stability we take for granted in modern thin-film ceramic substrate SMDs was exotic tech back then.
Which was precisely why I suggested a couple pages back that it might be "an interesting exercise" to try and build one from SMDs.

But until YOU mentioned it, bd couldn't be arsed, so whatever... unless it was my goading that prompted him to actually consider it.

mnem
*toddles off to warm bed and warm wife*