






It look´s like they used two test structures that where designed for smaller dies and combined them on one die of this wafer. Now the frame extends to the milling area.











































They sure needed a lot of resistors in that one!

































That pullup must be pretty beefy then. Not actually Darlington?
I find the layout unusual, or I'm rather rusty on reading ICs; hard to tell what's collector and emitter. And hard to see the diffusions under the metal layer; they're only barely visible in the tilted (perspective? and look at that metal thickness, cool) view.

Another great one, thank you!