I seem to have missed the big ADR1000 sale )) Where do you get them?
They are already available in alibaba
In the ADR1000 pin 4 is connected to the case. In the LTZ1000 (https://www.richis-lab.de/REF03.htm) the case wasn´t connected to pin 4 directly. There was just a connection through the substrate.
The die attache is done with some glue like material.
LTZ1000 was soldered which gave you a temperature resistance of 80K/W.
LTZ1000A was glued with some special fluffy polymer you can see in the LT1088 too (https://www.richis-lab.de/LT1088.htm). The temperature resistance was risen to 400K/W.
For the ADR1000 216K/W had to be good enough.
A very clean edge! Perhaps it´s normal. Perhaps they expended effort to get cleaner edges since impurities due to sawing of the wafer can worsen the stability?
ADR1000 is quite similar to the LTZ1000 but the heater structure is much simpler, no more spare structures.
The active parts are the same as in the LTZ1000 but here we have the possibility of a 4-wire-connection!
Thanks for the pictures. I'm somewhat of two minds, on one side I like to see some of the insides, on the other hand all that parts are lost forever
LT used ICA aka conductive adhesive in the LTZ1000, the die isn't soldered. In the LTZ1000A the adhesive is filled with glass beads, a material that hasn't many suppliers and was thought of for ADR1000 too, as said by Eric Modica at MM2021.
QuoteADR1000 is quite similar to the LTZ1000 but the heater structure is much simpler, no more spare structures.
Ah, you missed that part of explaination on that by Eric Modica.
Thanks for the pictures. I'm somewhat of two minds, on one side I like to see some of the insides, on the other hand all that parts are lost forever
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And of course I had to light it up (5mA).
It looks like the light is more uniform than in the LTZ1000. Perhaps here we see one reason for the lower noise figure? A more uniform structure in the buried zener?
https://www.richis-lab.de/REF19.htm
QuoteADR1000 is quite similar to the LTZ1000 but the heater structure is much simpler, no more spare structures.Ah, you missed that part of explaination on that by Eric Modica.That´s right. Can you enlight me?
Ask ADI for chips/dies only. I bet you get them for a small fraction of the ADR1000 price.
And you may experiment - I think bonding 10 wires cannot be a big problem in Germany..
It looks like the light is more uniform than in the LTZ1000. Perhaps here we see one reason for the lower noise figure? A more uniform structure in the buried zener?In the session, I posed the question to Eric Modia, how they achieved these 50% noise level compared to the LTZ.
His answers were
1. "Pure luck"
2. "Due to the lower reference voltage, the zener structure of the ADR1000 operates in the Zener effect mode, compared to the LTZ which operates in the more noisy Avalanche mode"
@Noopy:
1. in the presentation EricM explained why they went with single heating's ring..
2. bonding - not easy but in DE there is a lot of manufacturers/r&d_centers where they can bond a chip into a package. They usually use ceramic packages with N-pins for prototyping, afaik.
It looks like the light is more uniform than in the LTZ1000. Perhaps here we see one reason for the lower noise figure? A more uniform structure in the buried zener?In the session, I posed the question to Eric Modia, how they achieved these 50% noise level compared to the LTZ.
His answers were
1. "Pure luck"
2. "Due to the lower reference voltage, the zener structure of the ADR1000 operates in the Zener effect mode, compared to the LTZ which operates in the more noisy Avalanche mode"
Answer 2 seems wrong. In the zener mode the tempco would move into the negative area, wouldn´t it?